Following two successful participations at MWC Barcelona 2024 trade fairs, a distinguished group of 15 EIC-funded companies is set to present their groundbreaking products and services at the European Innovation Council Pavilion during MWC Barcelona 2024, 26-29 Febuary 2024.
The participating companies, representing key sectors of telecommunications, robotics and automation, blockchain, security, IoT, 3D and quantum technologies, are set to captivate audiences with their advanced products and trending technologies. This marks a significant occasion to illuminate the prowess of European tech innovation while providing these companies with a valuable platform to identify tangible business prospects alongside international counterparts.
Taking place from 26 to 29 Febuary 2024, in Barcelona, Spain, MWC Barcelona 2024 is a global trade fair for the mobile communications and telecoms industry. It serves as a collaborative nexus for networking and cultivating global connections. This event offers companies the chance to showcase their most innovative products and cutting-edge discoveries, meet potential partners, clients or investors. Attendees will have the opportunity to forge meaningful business connections with global stakeholders.
The EIC Pavilion can be found in the 4YFN area, Hall 8.1, Booth No: 8.1A20.
The EIC delegation participating is as follows:
- BILLON DIGITAL SERVICES (Poland)
- Cardlab Innovation ApS (Denmark)
- CINFO CONTENIDOS INFORMATIVOS PERSONALIZADOS SL (Spain)
- Codership (Finland)
- COMPIRA LABS LTD (Israel)
- CyRaCo GmbH (Germany)
- DRONE HOPPER, S.L. (Spain)
- EXCESS ENGINEERING AS (Norway)
- IGNION SL (Spain)
- ManoMotion AB (Sweeden)
- MYSPHERA SL (Spain)
- NIL TECHNOLOGY APS (Denmark)
- SELUXIT APS (Denmark)
- SettleMint NV (Belgium)
- VAULTREE LIMITED (Ireland)
The chosen companies are provided with personalised support through onboarding calls and a pre-departure briefing held today. This offers these companies the opportunity to connect with one another, share insights on best practices, and gain valuable insights into event-related logistics. This support service serves as a collaborative platform to foster interactions, facilitating not only knowledge exchange but also building a supportive network among participants.
Picture of the EIC pre-departure briefing
The European Innovation Council is also supporting the participation of 12 EIC-funded projects, under the EIC T2M Venture Building Programme. Discover the projects supported by the EIC T2M Venture Building Programme that will be at the MWCB2024 & 4YFN 2024 at Hall 8.1, Booths 8.1B53.7 and 8.1B53.8. Learn more about them here.
Learn more about the EIC ITF 3.0 programme:
Continuing the legacy of its predecessor, the EIC International Trade Fairs & USA Soft-landing Programme 3.0 is dedicated to supporting the global expansion of European startups, following the EIC Overseas Trade Fairs Programme OTF 2.0.
Stay informed about upcoming calls and access additional details on the EIC Community Platform, through our news, stories, and trade fairs related to ITF.
For any inquiries regarding the programme, feel free to reach out to us via the EIC Community Helpdesk. Simply select "EVENT - EIC ITF Programme - MWC 2024" as the subject in the "Category" field. We're here to assist you.
DISCLAIMER: This information is provided in the interest of knowledge sharing and should not be interpreted as the official view of the European Commission, or any other organisation.