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Story 19 April 2024
Public

EU companies to have an immersive experience into the US market thanks to the EIC USA Soft-landing Programme

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Joana Coimbra

A group of 15 EIC-backed companies was selected to take part in the EIC International Trade Fairs and Soft-landing Programme 3.0 and participate in a Soft-landing week with top experts in the field of Health and Life Sciences. After attending a successful pre-departure workshop, the EIC innovators are going to San Francisco and Silicon Valley from 19-24 May 2024, to meet with relevant stakeholders and explore business opportunities. 

The selected group of companies will receive the support of high-level local domain experts and access to dedicated pitching and networking activities. There will be targeted market insights and warm introductions to the most relevant stakeholders within the San Francisco/Silicon Valley ecosystem including high level investors, corporates and innovation hubs.  

The EIC USA Soft-landing is a comprehensive support programme, that includes, among other many things, an onsite activity to get business leads in San Francisco and Silicon Valley. For this second edition of the EIC USA Soft-landing programme, the EIC is partnering with its ambassador, experienced investor and entrepreneur, Jillian Manus, who also provided her insights during the pre-departure briefing. 

Exclusive partners from Stanford School of Medicine in Palo Alto, INSEAD San Francisco Hub, Nasdaq Entrepreneurial Center San Francisco, San Francisco Bay Area Council, members of the Commonwealth Club and Innovit, will meet with the selected companies. 

Meet the EIC Soft-landing participants: 

Picture of the EIC pre-departure briefing

Picture of the EIC pre-departure briefing

 

During the pre-departure briefing, companies learnt about: 

  • How to create a concise, comprehensive, and compelling pitch deck to share with potential business partners.  

  • How to develop an elevator pitch and be able to present this information with power and presence. 

  • Techniques to confidently answer all questions from potential investors and enterprise partners. 

  

Learn more about the EIC ITF 3.0 programme:   

The EIC International Trade Fairs & USA Soft-landing Programme 3.0 supports the internationalisation of European startups in continuity of the predecessor EIC Overseas Trade Fairs Programme OTF 2.0.   

Stay tuned on upcoming calls and find additional information and the EIC Community Platform through our news, stories and ITF-related trade fairs.   

Should you have any questions on the Programme, please do not hesitate to contact us through the EIC Community Helpdesk by selecting "EVENT - EIC ITF Programme – Soft-landing Silicon Valley 2024" as the subject in the "Category" field. 

DISCLAIMER: This information is provided in the interest of knowledge sharing and should not be interpreted as the official view of the European Commission, or any other organisation.

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